Microchannel heat sinks (MCHS) are commonly employed in highly efficient and compact electronic devices as an effective thermal management solution. However, despite their advantages, MCHS also suffer from two notable drawbacks: high-pressure drop and uneven temperature variation. Efforts have been taken to increase the rate of heat dissipation of microchannel heat sinks by incorporating transverse channels without incurring any penalty in terms of pressure drop. The heat dissipation performance is enhanced by the transverse channels in microchannel heat sinks, as they create disturbance and promote boundary layer regeneration. Increasing the number and length of transverse channels leads to a decrease in the average temperature of the bottom surface. An introduction of a sudden expansion in the cross-sectional flow area before the transverse channel enhances the heat transfer rate. Conversely, a decrease in the channel flow passage after the transverse channel results in improved heat dissipation performance and increases the pressure drop. The presence of transverse channels helps in recovering the pressure within the system.