In the context of modern computing technology, where multicore chips generate non-uniform heat loads contingent on computing workloads, traditional cold plate systems designed for uniform heat loads are inadequate. This study presents an experimental investigation into microchannel cold plate systems under non-uniform heat loads, addressing the need for effective cooling solutions in such scenarios. Three distinct inlet/outlet flow configurations denoted as U, I, and Z, are examined in this work. In this experimental setup, the nonuniform heat load is applied at the bottom of the cold plate by nine individual heaters to create the hotspot conditions. All the heaters are individually controlled, monitored the local temperature of each heater using digital temperature sensors. There are a total of 9 heaters and 9 hotspot heating cases. In each case, one heater will emit the hotspot heat flux. Two types of hotspot heat loads are applied to the cold plate's surface. For the first heat load condition, a single hotspot heater emits 43 W, while in the second heat load condition, it emits 84 W, representing varying levels of thermal stress. This study helps to understand the thermal performance of microchannel cold plates under non-uniform thermal load with a discussion of the temperature distribution profile and thermal resistance characteristics of the cold plate system.