The paper presents experimental investigation on electronic embedded system for thermal management using Al₂O₃/water nanofluid as coolant in microchannel heat sink (MCHS). The focus of the present study is to run the system with newly designed microfluidic cooling device maintaining the chip surface temperature below its critical limit. The MCHS is fabricated at the back of the actual processor chip package provided by the supplier. MCHS has ten parallel microchannels with Z-type flow configuration. Thermal design power (TDP) for actual processor chip is 95W, which is equivalent of heat flux generated by processor chip under full load condition. The aim of the present investigation is to observe the effect of Reynolds number and nanoparticle concentration at constant heat flux of 95W⁄cm² on heat transfer in MCHS. The Nusselt number for Al₂O₃/water nanofluid is found substantially higher as compared to those obtained with DW.