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Molecular Investigation towards Electrical Field Assisted Boiling Heat Transfer

Dhiraj Indana
MIED, IIT Roorkee

M B Darshan
MIED, IIT Roorkee

Arup Kumar Das
Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee 247667, India

Ravi Kumar
Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee, 247667, India

DOI: 10.1615/IHMTC-2017.1040
pages 741-746

Abstract

Molecular dynamic simulation tool have been used to study the behaviour of water molecules in electric field assisted boiling. It has been observed that there is a difference in a way the water molecules behave under the effect of positive and negative electric fields. When a positive electric field (1 N/C) is applied the molecules tend to move away from the heated surface similar to rapid boiling, but, a thin film of liquid is seen being attached to the surface even as the rapid boiling progresses. This helps in suppression of formation of vapour layer near the surface. Whereas, a negative electric field (-0.1 N/C) is found to assist nucleate boiling phenomena. To study the effect of varying temperature on electric field induced boiling, simulations have been carried out with two different temperatures (1000 K and 800K). It is intuitionally observed that the vapour bubble grows at a faster rate at high temperatures. A scheme of controlling boiling heat transfer is observed by varying application of electric field temporally which essentially turns on and off the boiling process.

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