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Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019)

ISSN: 2688-7231 (Online)

MITIGATION OF FLOW AND THERMAL NON-UNIFORMITY IN MEMS DEVICES: NUMERICAL INVESTIGATION

Mangal Singh Lodhi
Mechanical Engineering Discipline, PDPM Indian Institute of Information Technology, Design and Manufacturing, Jabalpur (MP)-482005, India

Tanuja Sheorey
Mechanical Engineering Discipline, PDPM Indian Institute of Information Technology, Design and Manufacturing, Jabalpur-482005, Madhya Pradesh, India

Goutam Dutta
Mechanical Engineering Discipline, PDPM Indian Institute of Information Technology, Design and Manufacturing, Jabalpur-482005, Madhya Pradesh, India; Department of Mechanical Engineering, IIT, Jammu (J & K)-181221, India

DOI: 10.1615/IHMTC-2019.450
pages 263-268

要約

The present research article focuses on the problem of flow and thermal non-uniformity in a microchannel heat sink (MCHS). A concept of variable size approach is employed to mitigate flow and thermal non-uniformity in I-type MCHS. The heat dissipation requirement of an electronic chip of 8th Generation Intel Core i9−8950K processor of 10 mm × 10 mm size is considered in the present study. It is observed that proposed design improves flow uniformity by 91.1% and thermal uniformity improves by 70%. It is also observed that proposed design decreases maximum temperature of chip surface about 3.93°C.

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