Indian Society for Heat and Mass Transfer
DIGITAL LIBRARY

ライブラリ登録: Guest
ホーム アーカイブ 役員 今後の会合
Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019)

ISSN: 2688-7231 (Online)

Interfacial Heat Transfer in Mild Steel Contacts Placed in Vacuum Environment

Surya Kumar
Department of Mechanical & Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee; Department of Mechanical Engineering, Katihar Engineering College, Katihar-854109

Andallib Tariq
Aerodynamics Visualization and Thermal Analysis Research (AVTAR) Laboratory, Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Uttarakhand-247667, India

DOI: 10.1615/IHMTC-2019.1880
pages 1119-1123

要約

Thermal contact conductance (TCC) is an important phenomenon in the field of interfacial heat transfer and had often been overlooked due to the complex mechanism of heat transfer involved at the interface of different metallic contacts. TCC signifies the quantitative information of interfacial heat transfer between metallic contacts. Unavailability of robust and versatile model which can accurately predict the TCC for different engineering applications makes experimental approach still most predominant way of TCC estimation. In the present investigation, TCC, in terms of solid spot conductance has been estimated for the contacts of mild steel placed in a vacuum environment. Steady state results are obtained from the experiments performed for different values of surface finish. The effects of loading and surface roughness on TCC are presented.

購入する $25.00 Check subscription 出版倫理および不正行為 私の図書館員へ推薦 このページをブックマークする