The rapid developments in chip industry to produce power density chips is not being translated into products due to the lack of efficient thermal management systems. Literature suggests that thermal management systems using Phase change materials can be an effective solution if their inherent low thermal conductivity can be enhanced. Various studies incorporating nanoparticles, fins and porous mesh inserts in PCMS has shown to be increasing the effective thermal conductivity and thermal performance. Liquid metals such as mercury, sodium etc. are used in high heat flux cooling applications such as nuclear reactors. The present numerical investigation studies heat transfer performance of the novel combination of Liquid metal and PCM. The Liquid metal is expected to promote the convective heat transfer through the pathways provided inside the PCM and therefore initiates uniform melting of PCM, which further mitigates the hot spots as it keeps the heater surface at isothermal temperatures with in the permissible limits. Three different configurations were considered for study 1) rectangular cavity filled with PCM and heated from below 2) where the liquid metal passages are provided for the same domain dividing the PCM domain into two parts 3) same as second domain but the PCM domain is divided in to four parts by the liquid metal passages. The current study shows that Configuration 3 among three PCM and liquid metal enclosures shows appreciable better results keeping the temperature around 325K ( permissible limits) until 977s that showed a reduction of 7.1% in plate temperature and 18.5% increase in melting rate when compared with Configuration 1.