Miniaturization of electronic components is fast happening due to the rapid advancements in the semiconductor industry. While Minichannels/microchannels have been identified as efficient cooling systems due to their ability to effectively transmit heat through liquid coolant, the ongoing trend of reducing the size of electronic devices necessitates enhancements in their thermal efficiency. Numerous methods for improving the thermal performance of mini channels have been extensively investigated, including the utilisation of Nano fluids, re-entrant paths, and surface modifications. However, there remains a persistent demand for the development of innovative techniques that can further enhance the thermal performance of these minichannels without increasing their size further. The present numerical study, proposes a novel way to enhance the heat transfer in minichannels. Conventional mini channel was modified by providing extra slots in the channel walls for the passage of working fluid, thereby, providing extra path way for the heat transfer besides keeping the equipment size the same. The present numerical investigation studies the heat transfer and pressure drop characteristics for varying slot diameters of 1mm, 1.5mm, and 2mm provided in the mini channel walls and for different Reynolds numbers ranging from 265 to 1065. Secondly, the effect of fluid entrance direction through the slot with respect to the channel flow direction was altered (i.e. parallel and counter flow configuration) and its effect over heat transfer and pressure drop was also studied. The results shows that the novel mini channel with slots in the channel wall found to appreciably increase the thermal performance criteria by 39%.