This study explores the use of higher heat flux dissipations at initial rows and subsequently decreasing values from heat sources subjected to forced convention cooling via air. The 3×3 array of square silicon heaters are used that resembles to integrated circuit (IC) chips on printed circuit boards. The substrate board of single layer copper clad board having thermal conductivity 8.8 W/m K is considered. Three dimensional steady state conjugate heat transfer module is selected from COMSOL Multiphysics 5.4 and studied heat transfer characteristics. This study is extensively carried out for higher heat flux values of 5000-15000 W/m² with air velocity of 1.5 m/s. Initially study is carried out for uniform heat flux of 10000 W/m². Then study is further extended by dissipating high heat fluxes in the range 10000 - 15000 W/m² from initial row and 5000-7500 W/m² from the suceeding rows. The average heat flux of 10000 W/m² is maintained. The least maximum temperature of 81.5 °C is observed in case 3 where heat flux dissipation are 12500, 10000, and 7500 W/m² in ascending order of rows as compared with all the cases studied. Results show that increase in higher heat dissipation is upto optimum limit after that maximum temperature on substrate board increases. Higher heat flux dissipations from initial rows is effective tool for heat transfer enhancement.