The present work investigates the comparative analysis of different active and passive heat transfer methodologies for thermal management of a 300 W LED module. Due to high-density packaging and increasing downsizing of electronic circuitry, heat generated from LED chips must be removed rapidly to avoid catastrophic failures. In this context, the real-time heat transfer experiments are performed over the LED using natural convection with and without heat sink, loop heat pipe, air/liquid jet impingement, and liquid spray. The steady-state substrate temperature is maintained below 95°C for the range of experimental parameters considered for each cooling method. Real-time heat transfer coefficient values at two radial locations are estimated for liquid jet and spray impingement methods. To determine the overall heat dissipation capacity, the thermal resistance of all cooling systems is compared. The junction temperature is numerically estimated for various heat transfer boundary conditions to complement our experimental results. The thermally critical locations are determined by analyzing the temperature and heat flux distribution over the LED assembly. The LEDs can be reliably run at 350 W (112% of nominal power) of electrical power for both water jet and spray cooling at a higher flow rate of coolant.