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Proceedings of the 27th National and 5th International ISHMT-ASTFE Heat and Mass Transfer Conference December 14-17, 2023, IIT Patna, Patna-801106, Bihar, India
December, 14-17, 2023, Bihar, India

Thermal management of high heat flux electronics subjected to power surge using a double layered wavy minichannel

Get access (open in a dialog) DOI: 10.1615/IHMTC-2023.1900
pages 1161-1167


In this work, the advantages of utilizing a double-layered wavy minichannel in the thermal management of high heat flux electronic chips subjected to power surge heat loads are investigated. The minichannel is designed to handle a nominal heat load of 200 W and a surge heat load of 300 W form a 20mm × 20mm electronic chip. The power surges occur periodically with a surge duration of 100 s and a surge interval of 100 s. The study focuses on exploring the effects of amplitude and wavelength of the wavy surface, as well as the Reynolds number in the bottom layer, on the thermal performance of heat sink subjected to power surges. The governing equations and their corresponding boundary conditions are solved numerically using the finite volume method-based commercial software ANSYS 2021R1.
The present design utilizes a counterflow of fluid in top layer to reduce streamwise temperature rise upto 10.6°C, compared to that without counterflow. The maximum temperature of the bottom heating surface decreases with an increase in the amplitude and increases with an increase in wavelength. Additionally, with an increase in the Reynolds number from 100 to 2000, the difference in thermal resistance of wavy and plane channels enhanced by 120%. These findings highlight the potential of the double-layered wavy minichannel design to effectively manage temperature rise in high heat flux electronic chips, both under normal operating conditions and during power surge events. The results provide valuable insights into the thermal behaviour and performance of the proposed cooling system, demonstrating its effectiveness in mitigating temperature fluctuations and enhancing thermal management in electronic chip applications.