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Proceedings of the 27th National and 5th International ISHMT-ASTFE Heat and Mass Transfer Conference December 14-17, 2023, IIT Patna, Patna-801106, Bihar, India
December, 14-17, 2023, Bihar, India

Enhancement in thermal management of electronic devices using thermosyphon assist phase change material: An experimental study

Get access (open in a dialog) DOI: 10.1615/IHMTC-2023.1940
pages 1189-1194


In this work, a thermosyphon assist phase change material (PCM) storage is used to examine the storage of heat power through the heat dissipation of electronic devices. Methanol, DI water, benzene and methyl acetate were employed as thermic fluids with heat load of 60 to 100 W. The various thermal effectiveness viz. rate of heat dissipation, heat transfer coefficient (HTC) and thermal resistance are assessed. Lauric acid is selected as the PCM. The influence of thermic fluids has been used to evaluate the charging and discharging properties of PCM. The results indicate that at 100 W, the methyl acetate exhibits the higher rate of heat dissipation, utmost HTC and lower thermal resistance of 98.9%, 201.99 W/(m2.K) and 0.42 °C/W respectively. Low heat of vapourization and the boiling point of methyl acetate are caused to the acquired results. The maximum storage of heat power by PCM is found to be 5.8 W when charging by the influence of methyl acetate at 100 W owing to the mass flow rate and time to reach the steady state temperature (ST) of PCM. Moreover, it encourages thermal management in electrical devices and at least 4% reductions in power use.