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Proceedings of the 27th National and 5th International ISHMT-ASTFE Heat and Mass Transfer Conference December 14-17, 2023, IIT Patna, Patna-801106, Bihar, India
December, 14-17, 2023, Bihar, India

Thermal Management of Electronic packages using Al2O3/water Nanofluid as Coolant in microchannel heat sink

Get access (open in a dialog) DOI: 10.1615/IHMTC-2023.1200
pages 743-748


The paper presents experimental investigation on electronic embedded system for thermal management using Al2O3/water nanofluid as coolant in microchannel heat sink (MCHS). The focus of the present study is to run the system with newly designed microfluidic cooling device maintaining the chip surface temperature below its critical limit. The MCHS is fabricated at the back of the actual processor chip package provided by the supplier. MCHS has ten parallel microchannels with Z-type flow configuration. Thermal design power (TDP) for actual processor chip is 95W, which is equivalent of heat flux generated by processor chip under full load condition. The aim of the present investigation is to observe the effect of Reynolds number and nanoparticle concentration at constant heat flux of 95W⁄cm2 on heat transfer in MCHS. The Nusselt number for Al2O3/water nanofluid is found substantially higher as compared to those obtained with DW.