Mangal Singh Lodhi
Mechanical Engineering Discipline, PDPM Indian Institute of Information Technology, Design and Manufacturing, Jabalpur (MP)-482005, India
Tanuja Sheorey
Mechanical Engineering Discipline, PDPM Indian Institute of Information Technology, Design and Manufacturing, Jabalpur-482005, Madhya Pradesh, India
Goutam Dutta
Mechanical Engineering Discipline, PDPM Indian Institute of Information Technology, Design and Manufacturing, Jabalpur-482005, Madhya Pradesh, India; Department of Mechanical Engineering, IIT, Jammu (J & K)-181221, India
The present research article focuses on the problem of flow and thermal non-uniformity in a microchannel heat sink (MCHS). A concept of variable size approach is employed to mitigate flow and thermal non-uniformity in I-type MCHS. The heat dissipation requirement of an electronic chip of 8th Generation Intel Core i9−8950K processor of 10 mm × 10 mm size is considered in the present study. It is observed that proposed design improves flow uniformity by 91.1% and thermal uniformity improves by 70%. It is also observed that proposed design decreases
maximum temperature of chip surface about 3.93°C.