ISSN Online: 2688-7231
ISBN Flash Drive: 978-1-56700-497-7
ISBN Online: 978-1-56700-496-0
Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019)
MITIGATION OF FLOW AND THERMAL NON-UNIFORMITY IN MEMS DEVICES: NUMERICAL INVESTIGATION
The present research article focuses on the problem of flow and thermal non-uniformity in a microchannel heat sink (MCHS). A concept of variable size approach is employed to mitigate flow and thermal non-uniformity in I-type MCHS. The heat dissipation requirement of an electronic chip of 8th Generation Intel Core i9−8950K processor of 10 mm × 10 mm size is considered in the present study. It is observed that proposed design improves flow uniformity by 91.1% and thermal uniformity improves by 70%. It is also observed that proposed design decreases maximum temperature of chip surface about 3.93°C.