ISSN オンライン: 2688-7231
ISBN 印刷: 978-1-56700-497-7 (Flash Drive)
ISBN オンライン: 978-1-56700-496-0
Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019)
Numerical Prediction & Optimization of Heat Dissipation Rates through Different Diameters and Different Coolants of Silicon & Copper Microchannels
Removal of high heat fluxes and keeping the temperature of gadgets within a safer limit is the prime objective of microchannel heat exchangers. The usage of the existing day cooling technology (forced air-cooled heat sink) is not effective to cool down microchips. Therefore, it is vital to choose an innovative and high-quality cooling scheme to meet the cooling requirement of the electronic circuitry for the impending years. The purpose of the paper is to find out a best possible combination of microchannel material, diameter and commercially viable coolants. The present analysis is at first validated with experimental works of available literature. Then it further deals with numerical approaches of both silicon and copper microchannels with five coolants namely water, hydrazile liquid, Engine oil, ammonia liquid, acetaldehyde. They are repeated over a range of diameters (250×400×500) µm, (300×600×700) µm, (200×450×500)µm, (350×750×600)µm. Those predicted values were further analyzed to find out the best coolant performance over a selected diameter. The role of channel diameter and coolant for enhanced heat transfer rate is further analyzed numerically.