カスタマーログイン ショッピングカート
ライブラリ登録: Guest
ホーム アーカイブ 役員 今後の会合

ISSN オンライン: 2688-7231

ISBN 印刷: 978-1-56700-497-7 (Flash Drive)

ISBN オンライン: 978-1-56700-496-0

Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019)
December, 28-31, 2019, IIT Roorkee, Roorkee, India

MITIGATION OF FLOW AND THERMAL NON-UNIFORMITY IN MEMS DEVICES: NUMERICAL INVESTIGATION

Get access DOI: 10.1615/IHMTC-2019.450
pages 263-268

要約

The present research article focuses on the problem of flow and thermal non-uniformity in a microchannel heat sink (MCHS). A concept of variable size approach is employed to mitigate flow and thermal non-uniformity in I-type MCHS. The heat dissipation requirement of an electronic chip of 8th Generation Intel Core i9−8950K processor of 10 mm × 10 mm size is considered in the present study. It is observed that proposed design improves flow uniformity by 91.1% and thermal uniformity improves by 70%. It is also observed that proposed design decreases maximum temperature of chip surface about 3.93°C.
ホーム アーカイブ 役員 今後の会合 English Русский 中文 Português ヘルプ 問合せ先 ISHMTへ戻る