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ISSN オンライン: 2688-7231

ISBN 印刷: 978-1-56700-497-7 (Flash Drive)

ISBN オンライン: 978-1-56700-496-0

Proceedings of the 25th National and 3rd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2019)
December, 28-31, 2019, IIT Roorkee, Roorkee, India

Interfacial Heat Transfer in Mild Steel Contacts Placed in Vacuum Environment

Get access DOI: 10.1615/IHMTC-2019.1880
pages 1119-1123

要約

Thermal contact conductance (TCC) is an important phenomenon in the field of interfacial heat transfer and had often been overlooked due to the complex mechanism of heat transfer involved at the interface of different metallic contacts. TCC signifies the quantitative information of interfacial heat transfer between metallic contacts. Unavailability of robust and versatile model which can accurately predict the TCC for different engineering applications makes experimental approach still most predominant way of TCC estimation. In the present investigation, TCC, in terms of solid spot conductance has been estimated for the contacts of mild steel placed in a vacuum environment. Steady state results are obtained from the experiments performed for different values of surface finish. The effects of loading and surface roughness on TCC are presented.
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