Flight Experiment of PCM coupled heat pipe onboard GSAT-29 spacecraft

Akhil  Jaiswal; Venkata  Raghavendra; Amrit Ambirajan; Alok Kumar Shrivastava; Pramod Kumar; Pradip Dutta

doi:10.1615/IHMTC-2021.2080

ISSN Online: 2688-7231

ISBN Online: 978-1-56700-524-0

Proceedings of the 26thNational and 4th International ISHMT-ASTFE Heat and Mass Transfer Conference December 17-20, 2021, IIT Madras, Chennai-600036, Tamil Nadu, India

December, 17-20, 2021, IIT Madras, Chennai, India

Flight Experiment of PCM coupled heat pipe onboard GSAT-29 spacecraft

Get access (open in a dialog) DOI: 10.1615/IHMTC-2021.2080
pages 1379-1383

Akhil Jaiswal
Thermal Systems Group, U. R. Rao Satellite Centre, ISRO, Bengaluru-560017, India

Venkata Raghavendra
Thermal Systems Group, U. R. Rao Satellite Centre, ISRO, Bengaluru-560017, India

Amrit Ambirajan
Thermal Systems Group, U R Rao Satellite Centre, Bangalore, INDIA; Department of Mechanical Engineering, IISc-Bangalore, 560012, India

Alok Kumar Shrivastava
ISRO Satellite Centre Bangalore, INDIA; Mechanical Systems Area, U R Rao Satellite Centre, Department of Space, Govt. of India, Bengaluru-560017, Karnataka, India

Pramod Kumar
Department of Mechanical Engineering, Indian Institute of Science, Bangalore-560012, India; Interdisciplinary Centre for Energy Research, Indian Institute of Science, Bangalore-560012, India

Pradip Dutta
Department of Mechanical Engineering, Indian Institute of Science, Bangalore-560012, India; Interdisciplinary Centre for Energy Research, Indian Institute of Science, Bangalore-560012, India

要約

Latent heat storage is a very effective method for thermal management of electronics with periodic operations. Considering this need, a PCM (phase change material) based heat storage device coupled with a heat pipe was developed and tested. In order to gain on-orbit experience with its performance and to have flight heritage, the hardware was flown onboard an ISRO spacecraft (GSAT-29) and successfully tested. This paper presents details of PCM module fabrication, test instrumentation, performance of PCM coupled heat pipe during thermal-vacuum test on ground, flight assembly and results of flight experiments.