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ISSN Online: 2688-7231

ISBN Online: 978-1-56700-478-6

Proceedings of the 24th National and 2nd International ISHMT-ASTFE Heat and Mass Transfer Conference (IHMTC-2017)
December, 27-30, 2017, BITS Pilani, Hyderabad, India

ACTIVE-PASSIVE COOLING SYSTEM IN POWER SURGE OPERATION OF ELECTRONICS

Get access (open in a dialog) DOI: 10.1615/IHMTC-2017.1730
pages 1251-1255

Resumo

The functionality of heat sink is enhanced by hybridizing the concept of active and passive cooling techniques. The heat sink is operated as a cooling device and as well as a surge protector. Not a special arrangement is made for this additional functionality but only a simple plate heat sink is embedded with phase change material (PCM) and a fan mounted over it. Only the proper arrangement of PCM and convective area for forced cooling gives rise to a new kind of heat sink which is called as active-passive heat sink. The power surge effect is studied experimentally for two different configurations. The first one is active, where a simple air based heat is taken and fan is placed over it which is similar to the heat sinks used in now-a-days commercial electronics. The second one is active-passive system, where PCM and air are placed side by side and fan is mounted over it. It is observed that active-passive heat sink gives better performance than only active one in power surge operation. In addition the hybrid PCM based heat sink can overturn the possibility of sudden and fatigue failure. At extremely high power surge operation, this configuration of heat sink shows the balanced performance.