Доступ предоставлен для: Guest

ISSN Online: 2688-7231

ISBN Online: 978-1-56700-524-0

Proceedings of the 26thNational and 4th International ISHMT-ASTFE Heat and Mass Transfer Conference December 17-20, 2021, IIT Madras, Chennai-600036, Tamil Nadu, India
December, 17-20, 2021, IIT Madras, Chennai, India

Three-dimensional pore scale modelling of PCM-metal foam composites for energy storage

Get access (open in a dialog) DOI: 10.1615/IHMTC-2021.590
pages 395-400

Аннотация

The study of phase change material-metal foam composites (PCM-M) has received a lot of attention in the past few years given its good energy storage density and high effective thermal conductivity. With a large surface area to volume ratio of the metallic structure owing to a system of overlapping pores, the PCM-M composites have significantly higher heat transfer rates for a given amount of metal as compared to fin-based structures. Significant effort has gone into modelling the behavior of PCM-M. A majority of the efforts have been through volume averaging method, but with the improvement of computational resources, concrete efforts have been made to accurately map the geometry of the pores at a pore-scale level. By capturing the geometry of the foam, accurate analysis of the heat transfer and temperature variations can be done. In the present study, a novel geometry creation model is used which utilizes the random sphere generation method. The study then aims to create a numerical model that solves the melting of PCM by enthalpy method and captures the effect of natural convection through the development of an in-house program. It seeks to quantify the effect of buoyancy driven natural convection during the melting process by comparing the convection based results with cases where the only mode of heat transfer is conduction. It is observed that the metal foam geometry greatly affects the melting behavior of the composite system and hence careful perusal must be done while designing similar systems in order to obtain maximum melting efficacy.