ISSN Online: 2688-7231
ISBN Online: 978-1-56700-524-0
Proceedings of the 26thNational and 4th International ISHMT-ASTFE Heat and Mass Transfer Conference December 17-20, 2021, IIT Madras, Chennai-600036, Tamil Nadu, India
Exploration of Fractal Patterns in Cold Plate Flow Path Design to Enhance the Heat Transfer Performance of IC Chips
Аннотация
The manuscript investigates the role of the natureinspired
fractal patterns of the liquid cold plate (copper/aluminum) path to enhance the heat transfer performance of the electronic components (heat-generating processors). A constant heat flux of 120W is considered on the bottom surface of the cold plate. Cold plates with different fractal designs are then attached to the top of these IC chips. The fractal designs considered in the present study are endlessly repeating patterns found in nature related to areas such as leaves, blood vessels, and snowflakes, etc. These designs help in increasing the heat dissipation rate of the IC chips while reducing the power requirement for pumping the coolant. Hence, this serves as a useful technique to enhance the energy efficiency of the IC chips.